ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,982, issued on Sept. 30, was assigned to KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION (Seoul, South Korea). "Multi-channel transistor... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,433,152, issued on Sept. 30, was assigned to SAMSUNG SDI Co. LTD. (Yongin-si, South Korea). "Compound for organic optoelectronic device, compo... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,048, issued on Sept. 30, was assigned to CyberArk Software Ltd. (Petach-Tikva, Israel). "Agentless single sign-on techniques" was invented... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,428,842, issued on Sept. 30, was assigned to Amrize Technology Switzerland LLC (Zug, Switzerland). "Multi-layered thermoplastic roofing membra... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,429,588, issued on Sept. 30, was assigned to Aeva Inc. (Mountain View, Calif.). "Techniques for dynamic trailer monitoring using frequency mod... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,637, issued on Sept. 30, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "Communication method and communications device f... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,429,495, issued on Sept. 30, was assigned to InvenSense Inc. (San Jose, Calif.). "MEMS strain sensitivity calibration" was invented by Matthew... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,429,814, issued on Sept. 30, was assigned to Canon K.K. (Tokyo). "Image forming apparatus, process cartridges, and connecting member" was inve... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,396, issued on Sept. 30, was assigned to Tokyo Electron Ltd. (Tokyo). "Temperature correction information calculation device, semiconducto... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,336, issued on Sept. 30, was assigned to Kokusai Electric Corp. (Tokyo). "Method of processing substrate, method of manufacturing semicond... Read More